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Grinder safety gauges can be used during the installation, maintenance, and inspection of bench/pedestal grinders to ensure work-rests and tongue-guards comply with OSHA's 1910.215 regulation and ANSI standards. To do so, wait until the wheel has completely stopped and the grinder is properly locked out before using a grinder safety gauge.
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- Maintaining and Repairing Machine As Automatic Dicing Saw (DAD 341, DAD 3350, DFD 6340, DAD 320), Fully Automatic Dicing Saw (DAD 641, DFD 651, DFD 641), Fully Automatic Grinder (DFG8540), Wafer Laser Mark (CSM2000), Fully Automatic BG Tape Laminator (RAD 3500), Substrate Cleaning System (SCS I124, EDC 400), Automatic Cleaning System (DCS 140 ...
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Buy and sell used and refurbished semiconductor equipment at used semiconductor equipment marketplace SurplusGlobal, SurplusGlobal serves various semiconductor manufacturing equipment such as used Amat CVD/endura, Tel Litius, Implanter, Lam 2300, Metrology equipment, Wire Bonder, ASML Stepper, etc.
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yield, even for today's ultrathin wafers. In-line system The DFP8140/8160's design allows it to be integrated with DISCO grinders for ... layout as the DISCO Fully Automatic Grinder (DFG8540/8560). This ensures reduced training time for operators familiar with DISCO equipment. For those new to the 8000 Series, the touch-screen
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Product lineup Applications Rough grinding Silicon Fine grinding Bond Grit size SDC340, SD340-SD400 SD2000-SD6000 Vitrified Gettering effect TEM damage comparison Mirror wafer (conventional stress relief surface) SiC surface roughness Gettering DP polished wafer D, 45D SD320-SD2000 Vitrified SD1500-SD based package Standard Silicon, resin based ...
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CHUCK TABLE FOR DFG8540/8560 WAFER GRINDER REPAIR OR REBUILD DFG8540 Front. DFG8540 Back. Great savings,prompt delivery world wide Posted by semixicon at ... end effector etc for ADT, K&S, DISCO machines. Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing ...
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Fully Automatic In Feed Surface Grinder DFG8540 8560 Fully Automatic In Feed Surface Grinder DFG8540 8560 Specifications Safe wafer handling with the thin wafer robot pick Environmental conditions • Use clean,oil free air at a dew point of 15 ℃or less. case study #1 Norton Abrasives
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DISCO DFG8540 grinder. The large silicon carrier wafers were from MEMC and had a diameter of 200.1 ± 0.1 mm. The device wafers that were bonded to the large carrier wafers had a diameter of 200 ± 0.1 mm. The edge-trimming process was done on a DISCO DFD6361 Fully Automatic Dicing Saw, and the front side of each wafer had 100
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Disco DFG8540. USED. Manufacturer: Disco. Model: DFG8540. Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding... Chandler, AZ, USA.
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DISCO's stealth dicing laser saws incorporate an SD ... DAG810 DFG8340 DFG8540 DFG8560 DFG8830 DFG8640 DGP8761 DFP8141 DFP8140 A compact and versatile automatic single spindle grinder Supports small-volume grinding with high precision Standard dual-spindle grinder Quad-spindle grinder designed to process hard materials such as sapphire and SiC ...
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Description. Please contact us if you are interested in the following items. These items are only for end users and are subject to prior sale without notice.
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DFP8140's design allows it to be integrated or retrofitted with DISCO grinders. Safer wafer transferring can be achieved when installed inline with DFG8540 (option). Environmentally friendly process. The dry polishing process does not require chemical processing through wet etching or CMP. Dry polishing with DFP8140 is environmentally ...
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Aug 10, 2022With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. STANDARD FEATURES INCLUDE: Automated thinning up to 200mm diameter wafers
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Download Original instruction of Bosch GWS 11-125 Professional Grinder for Free or View it Online on All-Guides. This version of Bosch GWS 11-125 Professional Manual compatible with such list of devices, as: GWS 15-125 Inox Professional, GWS 17-150 CI Professional, GWS 19-125 CIE Professional, GWS 19-125 CIST Professional, GWS 9-115 ...
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Ultra precision cutting process which diamond bit is used Biggest wafer size 300 mm Thickness variation within a wafer≦ 3.0 m Surface roughness of bump (Rz) ≦ Compact semi-auto device 1 axis 1 chuck table Wafer thickness measuring part loaded 2.0 kW spindle DISCO's operation common to grinders which is convenient to use Safety ...
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Nov 22, 2021Design flexibility The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.
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Support for the grinding of hard and brittle materials. This equipment is suitable for grinding difficult-to-process materials such as sapphire and SiC. DFG8830 is equipped with high power, high rigidity spindles and is compatible with large-diameter grinding wheels, making it possible to achieve fully automatic processing for difficult-to ...
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Disco DFG8540 CMP: Back Grinder Year (s) : 2015 Location : ASIA (North East) Price : On request More details 1 Disco DTG8440 CMP: Back Grinder Year (s) : 2017 Location : ASIA (North East) Price : On request More details 1 Mino DSG-1000 lit: Squeegee grinder Year (s) : 2011 Location : ASIA (North East) Price : On request More details 1 Logitech PP8
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DFG8540 Fully Automatic In-Feed Surface Grinder Supports advancements for thinner wafers • Φ200 mm • 2 axes, 3 chuck tables • Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility
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View Bruce Clark's profile on LinkedIn, the world's largest professional community. ... Disco DFG8540 Wafer Grinders, Disco DFD6340 Half-Cut Diesaws, System Fabrication,Equipment, Calibration ...
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Disco DFG8540 Back Grinder. Minimum thickness available: 270um Thicknesses that are available online (um): 280, 290, 350, 360, 368, 370, 380, 420, 445, 480, 500, 540. Company Confidential 165 Contactless Wafer Thickness and Geometry Gauge (Eichhorn + Hausmann MX204-8-21V)
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95 okamoto model gnx200 grinder s/n 111abgx07. 96 disco model dfg8540 grinder s/n jl1085. 97 disco model dfg850 grinder s/n ja112. 98 disco model dfg841 grinder s/n hw2011. 99 disco model dfg841 grinder s/n hw2022. 100 peter wolters model ac1200 grinder s/n ac891. 101 peter wolters model ac1200 grinder s/n ac888. 102 gnn model mpsr600 grinder s ...
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Grinders: Full Face Grinder DISCO DFG8540 and Taiko Grinder DISCO DTG8440. - Imparting knowledge, good working practices and process care principles to operators. ... Sales Director of the Retail Market at S&T w Polsce Piaseczno. 174 inne osoby o nazwisku Tomasz Piotrowski są na LinkedIn Zobacz innych o nazwisku Tomasz Piotrowski. Odznaka ...
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DISCO DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and...
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Inherited grinding specifications with an established reputation DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series. Thin grinding (100 µm)
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Backgrinding chuck for DFG8540 wafer grinder; wafer carrier; Keep walking with semi conductor industry with our... Al2O3,S-Sic,ZrO2,Si3N4 Data Sheet; How to Attach Samples to Carrier Wafers for Plasma... Sapphire substrates wafer carrier; Plaque de céramique et de l'anneau pour le polissa... Keramik platte und Ring zum Polieren von Saphir- W...
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Aug 10, 2022Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more STANDARD FEATURES INCLUDE: Grinds wafers 100 - 200mm
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DFG8340 is a simple and compact fully automatic grinder which adopts a single spindle, dual chuck table, and single turn table structure. It can process silicon wafers less than 8- inches with low-damage low-amount processing, and SiC, sapphire, and ceramics. A grinder that replaces lapping
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PowderMEMS is a powder-based microfabrication technology for substrate-level integration of three-dimensional functional microstructures into MEMS devices. The PowderMEMS process solidifies micron-sized particles via atomic layer deposition (ALD) in pre-processed cavities on planar substrates from a wide variety of materials. Low process temperatures and the absence of organic components ...
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Disco Grinders (DFG8540) ASM LPCVD Furnace ; Key Challenges: It is important that the candidate display the following behaviors: attention to detail, methodical decision making/troubleshooting skills, teamwork, and workplace organization. Good communication skills, both written and verbal are also a requirement. Candidate must be able to work ...
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Jun 15, 2022How we tested. Our pick: Baratza Encore. Flaws but not dealbreakers. Upgrade pick: Baratza Virtuoso+. Budget pick: OXO Brew Conical Burr Coffee Grinder. Also great: Timemore Chestnut C2 Manual ...
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The Disco DFG8540 System is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter and thin-finish grinding. The DFG8540's processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.
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Rochester Electronics (en-US) : Homepage
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800 DAG810 8" 1 1 、 DFG830 8" 2 2 8000 DFG8540 8" 2 3 DFG8560 300mm 2 3 8000-FullyAutomaticGrinder(1):80008000, ...
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DFG8640 Fully Automatic Grinder. ... DFG854013%。,,DFG85401.2。 ...
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Design flexibility The DFG8540/8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140/8160) for in-line processing solutions. DFG8560 Improved grinding quality Through design innovation, both spindles now grind wafers at the same relative position.
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Used Wafer Grinders. EquipNet is the world's leading provider of used wafer grinders and various other pre-owned equipment. Our exclusive contracts with our clients yield a wide range of used wafer grinders from a number of respected OEMs, including Disco Corporation and many others. We are constantly receiving used wafer grinders in a range of ...
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AP & S TwinStep-B H3P04 Semi-Automatic H3PO4 2 stage Megasonic QDR 36501 AppiledBoisystem ABI-3700 ANALYZER AUTOMATIC SEQUENCER 78336 Applied Materials VERITY 4i+ ... DFG8540 Wafer back grinder 79543 DAD3350 75704 DAD 640 Dicing Saw refurbished 81848 DFD6361 75706 79546 79551 DFD641 70080 75712 SINGULATION dicing saw 79552 75713 341 Dicing Saw ...
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